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Barun Electronics Co., Ltd.
 
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Barun Electronics Co., Ltd.
[Korea]
Address:
634-1 Tongsam-Ri Namsa-Myon Yongin Gyeonggi-do 449-884 Korea
Phone:
82-31-3223270
Contact name:
Christine Park , Manager
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Barun Electronics Co., Ltd.
 
Smart Card

SmartCard
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SmartCard
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Barun's IC packaging technologies offer a variety of customer oriented services in Smart Card business
Barun Electronics provides advanced packaging solutions as well as services in designing, developing, packaging, and testing Contact, RF, Combi modules, utilizing state-of-the-art equipment. Through rich experiences and ongoing R&D efforts, Barun has secured process & test technologies to embody as thin packages as 0.58mm Max for contact module and 0.40mm Max for RF module and guarantees a a global competence with the high standard of quality and reliability
 
Customized Packaging and Design Solution
Package Description
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
2.3 x 2.3mm
Max.0.58mm
Globe Top
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
3.5 x 3.5mm
Max.0.58mm
Globe Top
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
4.5 x 5.5mm
Max.0.58mm
Globe Top
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.4 x 13.3mm
2.0 x 2.0mm
Max.0.58mm
Globe Top
Package Description
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
2.3 x 2.3mm
Max.0.58mm
Globe Top
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
3.5 x 3.5mm
Max.0.58mm
Globe Top
 
Pitch
Punching Size
Max. Die Size
PKG Thickness
Encap. Method
 
14.25mm
11.8 x 13.0mm
4.5 x 5.5mm
Max.0.58mm
Globe Top

Related Keywords: smart media card , smart card , oscillator , chip scale package , ceramic lga


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